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REF1112AIDBZR - Texas Instruments

Description: 1-µA, 3-pin SOT-23 10-ppm/°C shunt voltage reference

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PCB Footprints
REF1112AIDBZR - Texas Instruments PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - DBZ
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REF1112AIDBZR - Texas Instruments  - 3D model - SOT23 (3-Pin) - DBZ
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REF1112AIDBZR Details

  • Manufacturer Part Number:

    REF1112AIDBZR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China, Philippines, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    OUTPUT VOLTAGE ADJUSTABLE FROM 1.2475V TO1.2525V

  • Analog IC - Other Type:

    TWO TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e4

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    1.2525 V

  • Output Voltage-Min:

    1.2475 V

  • Output Voltage-Nom:

    1.25 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TO-236

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.12 mm

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    50 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.2%

  • Width:

    1.3 mm

REF1112AIDBZR Frequently Asked Questions (FAQs)

  • For optimal performance, it is recommended to follow a star-grounding layout, where the REF1112AIDBZR is placed close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC), and the power supply lines are separated from the signal lines. Additionally, use a solid ground plane and avoid routing digital signals near the REF1112AIDBZR.
  • To ensure accurate voltage reference output, make sure to decouple the REF1112AIDBZR with a 10uF capacitor between the VOUT pin and GND, and a 0.1uF capacitor between the VIN pin and GND. Also, ensure that the input voltage is within the recommended operating range of 4.5V to 18V.
  • The thermal impedance of the REF1112AIDBZR package is typically around 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature.
  • The REF1112AIDBZR is rated for operation up to 125°C. However, the accuracy and stability of the voltage reference output may degrade at high temperatures. It is recommended to derate the output voltage and ensure proper thermal management to maintain accuracy and reliability.
  • To minimize noise and EMI, use a shielded enclosure, keep the REF1112AIDBZR away from noise sources, and use a low-pass filter or ferrite bead on the input and output lines. Additionally, ensure that the PCB layout is designed to minimize radiation and coupling between signals.

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REF1112AIDBZR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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