It's recommended to place the REF3325AIRSER close to the ADC, with a short and direct connection to minimize noise and parasitic inductance. A 4-layer PCB with a solid ground plane is recommended, and the REF3325AIRSER should be placed on the top layer with a local ground plane.
To ensure accurate voltage reference output, it's essential to decouple the REF3325AIRSER with a 10uF capacitor between the VOUT pin and GND, and a 0.1uF capacitor between the VIN pin and GND. Additionally, ensure the input voltage is within the recommended range (2.7V to 5.5V).
The thermal impedance of the REF3325AIRSER is typically around 30°C/W (junction-to-ambient thermal resistance). This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature.
The REF3325AIRSER is rated for operation up to 125°C, but its accuracy and stability may degrade at higher temperatures. If you need to operate in high-temperature environments, consider using a thermally-enhanced package or a different voltage reference with a higher temperature rating.
To minimize noise and EMI, use a low-ESR capacitor (e.g., X7R or X5R) for decoupling, keep the REF3325AIRSER away from high-current or high-frequency signals, and use a shielded enclosure or a metal can package to reduce radiated emissions.
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About Texas Instruments
Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.
