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REF6050IDGKR - Texas Instruments

Description: 5ppm/C High-Precision Voltage Reference with Integrated High-Bandwidth Buffer

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REF6050IDGKR - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - 8-VSSOP
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REF6050IDGKR - Texas Instruments  - 3D model - Small Outline Packages - 8-VSSOP
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REF6050IDGKR Details

  • Manufacturer Part Number:

    REF6050IDGKR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.90

  • Date Of Intro:

    2016-06-18

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • Input Voltage-Max:

    5.5 V

  • Input Voltage-Min:

    5.3 V

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    5.0025 V

  • Output Voltage-Min:

    4.9975 V

  • Output Voltage-Nom:

    5 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max (Isup):

    0.003 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    5.3 V

  • Supply Voltage-Nom (Vsup):

    5.4 V

  • Surface Mount:

    YES

  • Temp Coef of Voltage-Max:

    5 ppm/°C

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Voltage Tolerance-Max:

    0.05%

  • Width:

    3 mm

REF6050IDGKR Frequently Asked Questions (FAQs)

  • Texas Instruments recommends a compact, symmetrical layout with the REF6050IDGKR placed close to the analog-to-digital converter (ADC) or digital-to-analog converter (DAC) it is supplying. Keep the device away from high-current or high-frequency signals, and use a solid ground plane to minimize noise and electromagnetic interference (EMI).
  • Use a 10-100 nF ceramic capacitor in parallel with a 1-10 μF electrolytic capacitor, both connected between the VOUT pin and GND, to decouple the REF6050IDGKR. Place these capacitors as close to the device as possible to minimize inductance and ensure effective noise filtering.
  • The REF6050IDGKR has a specified temperature range of -40°C to 125°C. Over this range, the device's output voltage can vary by ±1.5 mV (±0.025%). To minimize temperature-related errors, ensure good thermal coupling between the REF6050IDGKR and the surrounding PCB, and consider using thermal shielding or heat sinks if operating in extreme environments.
  • Yes, the REF6050IDGKR can be used as a voltage reference for multiple devices, but be aware of the total output current requirement. The REF6050IDGKR can supply up to 10 mA of output current. If the total current requirement exceeds this limit, consider using a buffer amplifier or a separate voltage reference for each device.
  • To troubleshoot issues with the REF6050IDGKR, start by verifying the device's power supply, decoupling, and layout. Check for noise, EMI, or thermal issues that may be affecting the device's performance. Use an oscilloscope or multimeter to measure the output voltage and noise levels. Consult the datasheet and application notes for guidance on troubleshooting and optimization techniques.

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REF6050IDGKR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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