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RF430CL330HIRGTR - Texas Instruments

Description: Dynamic Dual Interface NFC Transponder

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PCB Footprints
RF430CL330HIRGTR - Texas Instruments PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RGT0016C-1
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3D Models
RF430CL330HIRGTR - Texas Instruments  - 3D model - Quad Flat No-Lead - RGT0016C-1
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RF430CL330HIRGTR Details

  • Manufacturer Part Number:

    RF430CL330HIRGTR

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Pin Count:

    16

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8523.59.00.00

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Additional Feature:

    3.0-3.6 SUPPLY AVAILABLE WHEN NO RF FIELD

  • JESD-30 Code:

    S-PQCC-N16

  • JESD-609 Code:

    e4

  • Length:

    3 mm

  • Memory Density:

    24576 bit

  • Memory IC Type:

    NFC/RFID TAGS AND TRANSPONDERS

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    3072 words

  • Number of Words Code:

    3000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    3KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC16,.12SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

RF430CL330HIRGTR Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the application note SLAA701, which includes guidelines for component placement, trace routing, and grounding to minimize electromagnetic interference (EMI) and ensure optimal performance.
  • To minimize power consumption, configure the device to operate in low-power mode (LPM) when not transmitting or receiving data. Additionally, adjust the transmission power, data rate, and modulation scheme to optimize power consumption for your specific application.
  • The RF430CL330HIRGTR is rated for operation from -40°C to 85°C, but it's essential to consider the specific application's thermal requirements and ensure proper thermal management to prevent overheating.
  • Yes, the RF430CL330HIRGTR can be used with an external antenna. However, it's crucial to ensure the antenna is properly matched to the device's impedance and that the antenna's radiation pattern is suitable for your application.
  • To troubleshoot RF performance issues, use tools like a spectrum analyzer or a protocol analyzer to identify issues with transmission power, frequency, or modulation. Also, verify the device's configuration, antenna performance, and the surrounding RF environment.

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RF430CL330HIRGTR Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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