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RFPA5512TR13 - Qorvo

Description: RF Amplifier 4.9-5.85GHzGain 33dB Pout 23dBm

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PCB Footprints
RFPA5512TR13 - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN, 20-pin, 4.0mm x 4.0mm x 0.9mm
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3D Models
RFPA5512TR13 - Qorvo  - 3D model - Quad Flat No-Lead - QFN, 20-pin, 4.0mm x 4.0mm x 0.9mm
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RFPA5512TR13 Details

  • Manufacturer Part Number:

    RFPA5512TR13

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    4 X 4 MM, 0.90 MM HEIGHT, GREEN, QFN-20

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Qorvo

  • YTEOL:

    0

  • JESD-30 Code:

    S-XQCC-N20

  • Length:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.85 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

RFPA5512TR13 Frequently Asked Questions (FAQs)

  • Qorvo provides a recommended PCB layout and thermal management guide in their application note AN-2171, which includes guidelines for thermal pad connection, heat sink attachment, and PCB layout considerations.
  • Qorvo provides a set of impedance data in the datasheet, which can be used to design input and output matching networks using tools like Qorvo's own RF design software, Genesys, or third-party tools like ADS or AWR Microwave Office.
  • The maximum SOA is defined by the device's voltage, current, and power ratings. Qorvo provides a SOA graph in the datasheet, and recommends using their SOA calculator tool to ensure the device is operated within the safe region.
  • The RFPA5512TR13 has a built-in thermal shutdown feature that disables the device when the junction temperature exceeds 150°C. Qorvo recommends using an external temperature sensor and a microcontroller to monitor the device temperature and implement a shutdown sequence if necessary.
  • Qorvo provides a set of assembly and soldering guidelines in their application note AN-2171, which includes recommendations for reflow soldering, wave soldering, and manual assembly.

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RFPA5512TR13 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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