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RFPA5542BTR13 - Qorvo

Description: RF Amplifier 5GHZ Discrete PA

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PCB Footprints
RFPA5542BTR13 - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RFPA5542BTR13
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3D Models
RFPA5542BTR13 - Qorvo  - 3D model - Quad Flat No-Lead - RFPA5542BTR13
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RFPA5542BTR13 Details

  • Manufacturer Part Number:

    RFPA5542BTR13

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HVQCCN,

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8542.39.00.01

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Qorvo

  • YTEOL:

    0

  • JESD-30 Code:

    S-XQCC-N20

  • Length:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.4 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

RFPA5542BTR13 Frequently Asked Questions (FAQs)

  • Qorvo provides a recommended PCB layout and thermal management guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, thermal dissipation, and to prevent thermal shutdown.
  • Qorvo provides a set of recommended input and output matching networks in their datasheet and application notes. However, the optimal matching network may vary depending on the specific application and frequency band. Engineers can use simulation tools like ADS or AWR to optimize the matching networks for their specific use case.
  • The maximum safe operating area (SOA) for the RFPA5542BTR13 is not explicitly stated in the datasheet. However, Qorvo provides a set of recommended operating conditions and absolute maximum ratings in the datasheet. Engineers should ensure that their application operates within these recommended conditions to prevent damage to the device.
  • The RFPA5542BTR13 has a built-in thermal shutdown feature that activates when the device temperature exceeds a certain threshold. Engineers should ensure that their design includes a thermal management strategy to prevent thermal shutdown. This may involve using heat sinks, thermal interfaces, and thermal simulation tools to ensure the device operates within a safe temperature range.
  • The recommended biasing and sequencing for the RFPA5542BTR13 is provided in the datasheet and application notes. Engineers should follow these guidelines to ensure proper device operation and to prevent damage to the device.

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RFPA5542BTR13 Overview

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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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