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RFPA5542SR - Qorvo

Description: POUT = 23dBm, 5V, 11ac, 80MHz MCS9 at 1.8% EVM POUT = 25dBm, 5V, 11n, 20/40MHz MCS7 at 3% EVM Typical Gain = 33dB High PAE

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Symbol
RFPA5542SR - Qorvo - PCB symbol
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PCB Footprints
RFPA5542SR - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - RFPA5542BTR13.
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3D Models
RFPA5542SR - Qorvo - 3D model - Quad Flat No-Lead - RFPA5542BTR13.
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RFPA5542SR Details

  • Manufacturer Part Number:

    RFPA5542SR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    QFN-20

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Qorvo

  • YTEOL:

    0

  • JESD-30 Code:

    S-XQMA-N20

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    MICROELECTRONIC ASSEMBLY

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    4 mm

RFPA5542SR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure good thermal conductivity by using a thermal pad and connecting it to a heat sink or a metal plate.
  • Use a load-pull analysis or a circuit simulator like ADS or AWR to optimize the input and output matching networks for maximum power and efficiency. Consider the device's S-parameters and the application's specific requirements.
  • Operate the device within the recommended temperature range (-40°C to 85°C) and voltage range (3.3V to 5V). Ensure proper thermal management and avoid exceeding the maximum junction temperature (150°C).
  • Implement a thermal monitoring and shutdown mechanism. Use a thermistor or a temperature sensor to monitor the device temperature and shut down the device if it exceeds the maximum junction temperature.
  • Handle the device with ESD-protective equipment and follow proper ESD handling procedures. The device has built-in ESD protection, but it's not a substitute for proper handling and storage procedures.

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RFPA5542SR Overview

Use the download button to access the RFPA5542SR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RFPA5, or try a keyword search, such as Other Telecom ICs

About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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