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RFSA3713TR7 - Qorvo

Description: 5 - 6000 MHz Serial Controlled Digital Step Attenuator, 7-Bit, 0.25 dB Steps

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Symbol
RFSA3713TR7 - Qorvo - PCB symbol
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PCB Footprints
RFSA3713TR7 - Qorvo PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - QFN-16_2022
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3D Models
RFSA3713TR7 - Qorvo - 3D model - Quad Flat No-Lead - QFN-16_2022
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RFSA3713TR7 Details

  • Manufacturer Part Number:

    RFSA3713TR7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    QFN-16

  • ECCN Code:

    5A991.B

  • HTS Code:

    8542.39.00.90

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    Qorvo

  • JESD-30 Code:

    S-XQCC-N16

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVQCCN

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Telecom IC Type:

    TELECOM CIRCUIT

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    3 mm

RFSA3713TR7 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Use a via-stitching technique to connect the ground plane to the heat sink. Ensure a low-impedance path to ground for the RF signal.
  • Use a resistive divider network to set the bias voltage. Ensure the bias voltage is within the recommended range (2.5V to 5.5V). Use a low-dropout regulator (LDO) to minimize power consumption.
  • Use a pi-network or a T-network for input and output matching. The values of the matching components depend on the specific application and frequency of operation. Consult the application note or a qualified RF engineer for guidance.
  • Use a heat sink with a thermal conductivity of at least 1 W/m-K. Ensure good thermal contact between the device and the heat sink. Keep the ambient temperature below 85°C and ensure good airflow around the device.
  • Use a human-body model (HBM) ESD protection diode (e.g., 1.5 kV) on the RF input and output pins. Ensure the PCB layout and component placement minimize the risk of ESD damage.

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RFSA3713TR7 Overview

Use the download button to access the RFSA3713TR7 schematic symbol, PCB footprint, and 3D model.
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About Qorvo

Qorvo is a prominent American semiconductor company that specializes in the design and manufacturing of radio frequency (RF) solutions. The company was formed in 2015 through the merger of TriQuint Semiconductor and RF Micro Devices. Qorvo's product portfolio encompasses a wide range of RF components and semiconductor technologies used in various applications, including wireless communications, aerospace and defense, and IoT (Internet of Things) devices.

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