RG2012N-201-W-T1 footprint, schematic symbol and 3D model by Susumu

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RG2012N-201-W-T1 Details

The recommended land pattern for the RG2012N-201-W-T1 is a rectangular pad with a size of 1.2mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solderable finish.
To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink attached to the component. Keep the surrounding components at a safe distance to prevent thermal interference. Follow the recommended PCB layout and thermal management guidelines provided by Susumu Co Ltd.
The maximum operating temperature range for the RG2012N-201-W-T1 is -55°C to +125°C. However, it's recommended to operate the component within the specified temperature range for optimal performance and reliability.
Yes, the RG2012N-201-W-T1 is suitable for high-frequency applications up to 6 GHz. However, it's essential to follow the recommended PCB layout and impedance matching guidelines to ensure optimal performance and minimize signal loss.
Store the RG2012N-201-W-T1 in a dry, cool place, away from direct sunlight and moisture. Handle the component by the body, avoiding touching the leads or electrical contacts. Use anti-static precautions when handling the component to prevent electrostatic discharge (ESD) damage.

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Use the download button to access the RG2012N-201-W-T1 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like RG201, or try a keyword search, such as Fixed Resistors

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Image	Part Number	Model
	RG2012N-201-B-T1 Susumu Co Ltd Fixed Resistor, Metal Film, 0.125W, 200ohm, 100V, 0.1% +/-Tol, -10,10ppm/Cel, 0805
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