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RGS80TSX2HRC11 - ROHM Semiconductor

Description: IGBT Transistors 1200V 40A Field Stop Trench IGBT. RGS80TSX2HR is a highly reliable IGBT for automotive inverter, heater.

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PCB Footprints
RGS80TSX2HRC11 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247N_2021
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RGS80TSX2HRC11 - ROHM Semiconductor  - 3D model - Transistor Outline, Vertical - TO-247N_2021
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RGS80TSX2HRC11 Details

  • Manufacturer Part Number:

    RGS80TSX2HRC11

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TO-247N, 3 PIN

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2019-09-09

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Collector Current-Max (IC):

    80 A

  • Collector-Emitter Voltage-Max:

    1200 V

  • Configuration:

    SINGLE

  • Gate-Emitter Thr Voltage-Max:

    7 V

  • Gate-Emitter Voltage-Max:

    30 V

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    555 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    629 ns

  • Turn-on Time-Nom (ton):

    89 ns

  • VCEsat-Max:

    2.1 V

RGS80TSX2HRC11 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC to improve heat dissipation. A 2-layer or 4-layer PCB with a thermal relief pattern is also recommended to reduce thermal resistance.
  • Ensure that the input voltage is within the recommended range, and that the device is properly decoupled with a 10uF capacitor. Also, ensure that the PCB is designed to minimize thermal gradients.
  • The maximum allowed power dissipation is 2.5W. However, it's recommended to keep the power dissipation below 2W to ensure reliable operation.
  • Yes, the RGS80TSX2HRC11 is designed for high-reliability applications. It has undergone rigorous testing and meets the requirements of AEC-Q101, making it suitable for automotive and industrial applications.
  • Use a voltage regulator or a TVS diode to protect the device from overvoltage. Also, use a current limiter or a fuse to protect the device from overcurrent.

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RGS80TSX2HRC11 Overview

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