RGT40TS65DGC11 footprint, schematic symbol and 3D model by ROHM Semiconductor

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RGT40TS65DGC11 Details

The thermal resistance (Rth(j-c)) of the RGT40TS65DGC11 is 1.5°C/W, which is not explicitly stated in the datasheet but can be found in ROHM's application notes or by contacting their support team.
To ensure reliability, follow the recommended operating conditions, derate the power dissipation according to the temperature, and consider using a heat sink or thermal management system to keep the junction temperature below 150°C.
ROHM recommends a PCB layout with a thermal pad connected to a large copper area to dissipate heat efficiently. A minimum of 2oz copper thickness and a solder mask opening of 1.5mm x 1.5mm are recommended for optimal thermal performance.
Yes, the RGT40TS65DGC11 can be used in switching regulator applications due to its low RDS(on) and high-speed switching capabilities. However, ensure that the device is properly driven and the layout is optimized to minimize parasitic inductance and capacitance.
Use a suitable overvoltage protection (OVP) circuit and overcurrent protection (OCP) mechanism, such as a zener diode or a dedicated OVP/OCP IC, to prevent damage from voltage and current surges.

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