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RGT8BM65DTL - ROHM Semiconductor

Description: ROHM - RGT8BM65DTL - IGBT, SINGLE, 650V, 8A, TO-252-3

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Symbol
RGT8BM65DTL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RGT8BM65DTL - ROHM Semiconductor PCB footprint - Other - Other - ROHM_TO-252-3
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3D Models
RGT8BM65DTL - ROHM Semiconductor - 3D model - Other - ROHM_TO-252-3
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RGT8BM65DTL Details

  • Manufacturer Part Number:

    RGT8BM65DTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.82

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    8 A

  • Collector-Emitter Voltage-Max:

    650 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    158 ns

  • Turn-on Time-Nom (ton):

    54 ns

RGT8BM65DTL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RGT8BM65DTL is -40°C to 150°C.
  • To ensure reliability, follow the recommended derating guidelines, use a suitable thermal management system, and consider using a heat sink or thermal interface material.
  • Follow the recommended PCB layout and thermal design guidelines provided in the datasheet, and consider using thermal vias and a heat sink to improve thermal dissipation.
  • Use a suitable heat sink, thermal interface material, and ensure good airflow around the device. Also, consider using a thermal management IC or a fan to improve cooling.
  • Handle the device with an anti-static wrist strap or mat, and follow proper ESD protection procedures during assembly and storage to prevent damage.

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RGT8BM65DTL Overview

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