Littelfuse recommends a thermal pad layout with a minimum of 2 oz copper thickness, and a thermal relief pattern to ensure good heat dissipation. A minimum of 1 inch x 1 inch copper area is recommended around the device for optimal thermal performance.
Littelfuse recommends using a soldering iron with a temperature range of 250°C to 260°C, and a solder with a melting point of 217°C to 220°C. The device should be soldered within 3 seconds to 5 seconds, and the solder joints should be inspected for proper wetting and filleting.
The RHEF1100 has a maximum surge current rating of 100 A for 8.3 ms, and 50 A for 20 ms. However, it's essential to note that the surge current rating may vary depending on the specific application and operating conditions.
While the RHEF1100 is primarily designed for low-frequency applications, it can be used in high-frequency applications up to 100 kHz. However, the device's performance and characteristics may vary at higher frequencies, and additional testing and validation may be required.
The RHEF1100 is designed to withstand overvoltage conditions up to 1.5 times the rated voltage. In the event of an overvoltage condition, the device will enter a high-impedance state to protect itself and the surrounding circuitry. However, prolonged exposure to overvoltage conditions may affect the device's reliability and lifespan.
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RHEF1100 Overview
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