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RN2906FE,LF(CT - Toshiba

Description: PNP x 2 BRT, Q1BSR=4.7kOhm, Q1BER=47kOhm, Q2BSR=4.7kOhm, Q2BER=47kOhm, VCEO=-50V, IC=-0.1A

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PCB Footprints
RN2906FE,LF(CT - Toshiba PCB footprint - Other - Other - SOT-563 (ES6)
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3D Models
RN2906FE,LF(CT - Toshiba  - 3D model - Other - SOT-563 (ES6)
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RN2906FE,LF(CT Details

  • Manufacturer Part Number:

    RN2906FE,LF(CT

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Toshiba America Electronic Components

  • YTEOL:

    6

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

RN2906FE,LF(CT Frequently Asked Questions (FAQs)

  • Toshiba provides a recommended PCB layout in their application note AN-1201, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • The RN2906FE,LF requires a specific biasing scheme to operate correctly. Toshiba recommends using a voltage regulator to provide a stable 3.3V supply, and ensuring that the input voltage is within the recommended range of 2.7V to 3.6V. Additionally, the datasheet provides guidelines for biasing the output stage.
  • The RN2906FE,LF is rated for operation from -40°C to +125°C, but Toshiba recommends derating the device for reliable operation above 85°C. The datasheet provides thermal derating curves to help designers determine the maximum operating temperature for their specific application.
  • Toshiba provides troubleshooting guidelines in their application note AN-1202, which covers common issues and their causes, as well as recommended solutions and debugging techniques. Additionally, designers can consult the datasheet and contact Toshiba's technical support team for assistance.
  • Yes, the RN2906FE,LF is a high-frequency device that requires careful attention to EMI/EMC considerations. Toshiba recommends following good design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering to reduce EMI. The datasheet provides additional guidelines for EMI/EMC compliance.

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RN2906FE,LF(CT Overview

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