ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane or a dedicated heat sink.
To ensure stability, ROHM recommends a minimum output capacitance of 10uF, with an ESR of 0.1Ω or less. Additionally, the input capacitor should be at least 1uF, with an ESR of 0.1Ω or less. The PCB layout should also be designed to minimize parasitic inductance and resistance.
The maximum allowed voltage on the enable pin (EN) is 6V. Exceeding this voltage may damage the internal circuitry. It's recommended to use a voltage divider or a level shifter if the control signal is higher than 6V.
The RQ6E045BNTCR is rated for operation up to 125°C. However, the maximum junction temperature (Tj) should not exceed 150°C. It's essential to ensure proper heat dissipation and thermal management to prevent overheating, especially in high-temperature environments.
The power dissipation (PD) can be calculated using the formula: PD = (VIN - VOUT) x IOUT. Where VIN is the input voltage, VOUT is the output voltage, and IOUT is the output current. The maximum power dissipation is 1.5W, and it's essential to ensure the device is operated within this limit to prevent overheating.
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RQ6E045BNTCR Overview
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