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RRR030P03TL - ROHM Semiconductor

Description: 4V Drive Pch MOSFET: Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications.Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

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RRR030P03TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RRR030P03TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TSMT3
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3D Models
RRR030P03TL - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - TSMT3
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RRR030P03TL Details

  • Manufacturer Part Number:

    RRR030P03TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.075 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RRR030P03TL Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. The copper area should be connected to a ground plane or a heat sink to further improve thermal performance.
  • To ensure stability, a minimum output capacitance of 10uF is recommended, and the output capacitor should be placed as close to the output pin as possible. Additionally, a 1uF ceramic capacitor can be added in parallel to improve high-frequency stability.
  • Although the datasheet specifies a maximum input voltage of 30V, it's recommended to limit the input voltage to 25V to ensure reliable operation and prevent damage to the device.
  • While the RRR030P03TL is rated for operation up to 125°C, it's essential to consider the derating curves in the datasheet to ensure the device can handle the expected power dissipation in high-temperature environments.
  • Implementing overcurrent protection (OCP) and overvoltage protection (OVP) circuits can help prevent damage to the device. Additionally, a thermal monitoring circuit can be used to shut down the device in case of overheating.

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RRR030P03TL Overview

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