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RSC002P03T316 - ROHM Semiconductor

Description: Pch -30V -250mA Small Signal MOSFET

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Symbol
RSC002P03T316 - ROHM Semiconductor - PCB symbol
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PCB Footprints
RSC002P03T316 - ROHM Semiconductor PCB footprint - Other - Other - SOT-23 (SST3)
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3D Models
RSC002P03T316 - ROHM Semiconductor - 3D model - Other - SOT-23 (SST3)
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RSC002P03T316 Details

  • Manufacturer Part Number:

    RSC002P03T316

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    6.5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    0.25 A

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.2 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSC002P03T316 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a thermal relief pattern is suggested to improve heat dissipation.
  • Monitor the input voltage, output current, and ambient temperature to ensure they are within the specified ranges. Also, ensure proper thermal management and PCB design.
  • A low-ESR ceramic capacitor (e.g., X5R or X7R) with a value of 4.7uF to 10uF is recommended for input decoupling, depending on the specific application requirements.
  • Yes, the RSC002P03T316 is AEC-Q100 qualified and suitable for automotive and high-reliability applications, but ensure compliance with specific industry standards and regulations.
  • Check the input voltage, output current, and ambient temperature. Verify proper PCB design, thermal management, and component selection. Consult the datasheet and application notes for troubleshooting guidelines.

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RSC002P03T316 Overview

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