A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
The device requires a stable input voltage (VIN) and a bypass capacitor (CBYP) to ensure proper biasing. A 10uF ceramic capacitor is recommended for CBYP.
The maximum power dissipation is 1.5W. Exceeding this limit may cause the device to overheat and reduce its lifespan.
The device is rated for operation up to 125°C. However, derating is required for temperatures above 85°C to ensure reliable operation.
Handle the device with an ESD wrist strap or mat, and ensure that the PCB has ESD protection circuits, such as TVS diodes, to prevent damage.
Trust Checks
This model has been verified by system checks.
System Verified
Sponsored
RSQ035P03TR Overview
Use the download button to access the RSQ035P03TR schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like RSQ03,
or try a keyword search, such as Small Signal Field-Effect Transistors
Suggested Parts
If you searched for RSQ035P03TR, you might also be interested in these parts: