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RSR015P03TL - ROHM Semiconductor

Description: ROHM - RSR015P03TL - MOSFET, P CH, 20V, 2A, TSMT3

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Symbol
RSR015P03TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RSR015P03TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TSMT3_2
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3D Models
RSR015P03TL - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - TSMT3_2
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RSR015P03TL Details

  • Manufacturer Part Number:

    RSR015P03TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.5 A

  • Drain-source On Resistance-Max:

    0.235 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RSR015P03TL Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • The device requires a stable input voltage and a proper biasing circuit to ensure optimal performance. A voltage regulator and a bias resistor network can be used to achieve this.
  • The maximum allowable power dissipation is dependent on the ambient temperature and the thermal resistance of the PCB. A maximum power dissipation of 1.5W is recommended, but this can be increased with proper heat sinking and thermal design.
  • Yes, the RSR015P03TL is suitable for high-frequency applications up to 100MHz. However, the device's performance may degrade at higher frequencies due to internal capacitances and inductances.
  • The device is sensitive to ESD. Proper ESD protection measures should be taken during handling and assembly, such as using an ESD wrist strap, anti-static bags, and ESD-safe workbenches.

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RSR015P03TL Overview

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