- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for RTF015P02TL
- Part Number RTF015P02TL
- Manufacturer ROHM Semiconductor
- Pin Count 3
- Part Category MOSFET (P-Channel)
- Package Category SO Transistor Flat Lead
- Footprint Name SO Transistor Flat Lead - SOT-323T (TUMT3)
- Released Date Mar 3, 2018
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
RTF015P02TL Details
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Manufacturer Part Number:
RTF015P02TL
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Obsolete
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Package Description:
TUMT3, 3 PIN
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Pin Count:
3
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ECCN Code:
EAR99
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Manufacturer:
ROHM Semiconductor
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YTEOL:
0
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Configuration:
SINGLE WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
20 V
RTF015P02TL Frequently Asked Questions (FAQs)
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A recommended PCB layout for optimal thermal performance would be to have a large copper area on the bottom layer connected to the thermal pad, and to use thermal vias to dissipate heat. Additionally, keeping the PCB layers as thin as possible and using a thermal interface material can also help.
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To ensure proper soldering, use a soldering iron with a temperature of 350°C to 370°C, and apply a small amount of solder paste to the pads. Use a soldering technique that minimizes the time the iron is in contact with the device. Also, ensure the device is handled by the package, not the pins, to prevent damage.
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The recommended storage condition for the RTF015P02TL is in a dry, cool place, away from direct sunlight and moisture. The device should be stored in its original packaging or in a similar anti-static package to prevent damage from electrostatic discharge.
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While the RTF015P02TL is designed to operate in a variety of environments, it's not recommended to use it in high-humidity environments without proper protection. If operation in high humidity is necessary, consider using a conformal coating or potting the device to prevent moisture ingress.
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The maximum allowable power dissipation for the RTF015P02TL is dependent on the ambient temperature and the thermal resistance of the device. Refer to the datasheet for the power dissipation curves and thermal resistance values to determine the maximum allowable power dissipation for your specific application.
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