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RTR030N05HZGTL - ROHM Semiconductor

Description: Nch 45V 3A Small Signal MOSFET for Automotive

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Symbol
RTR030N05HZGTL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RTR030N05HZGTL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TSMT3
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3D Models
RTR030N05HZGTL - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - TSMT3
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RTR030N05HZGTL Details

  • Manufacturer Part Number:

    RTR030N05HZGTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-96, SOT-346T, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2018-04-19

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    45 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.095 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    55 pF

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RTR030N05HZGTL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RTR030N05HZGTL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines, ensure proper thermal management, and consider the device's thermal resistance and power dissipation.
  • The recommended PCB layout and thermal design for the RTR030N05HZGTL involves using a thermal pad, thermal vias, and a heat sink to ensure efficient heat dissipation. Consult the ROHM Semiconductor application note for detailed guidelines.
  • When designing and testing with the RTR030N05HZGTL, ensure that your test equipment and design can handle the device's high voltage and current ratings. Use proper safety precautions, such as insulation and isolation, to prevent electrical shock and damage.
  • The RTR030N05HZGTL is a sensitive device and requires proper ESD protection and handling precautions. Use anti-static wrist straps, mats, and packaging to prevent damage from electrostatic discharge.

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RTR030N05HZGTL Overview

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