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RTR040N03HZGTL - ROHM Semiconductor

Description: Nch 30V 4A Small Signal MOSFET for Automotive

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PCB Footprints
RTR040N03HZGTL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-346T
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3D Models
RTR040N03HZGTL - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - SOT-346T
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RTR040N03HZGTL Details

  • Manufacturer Part Number:

    RTR040N03HZGTL

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SC-96, SOT-346T, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Date Of Intro:

    2018-04-19

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.066 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RTR040N03HZGTL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RTR040N03HZGTL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines, use a suitable thermal design, and ensure proper cooling mechanisms are in place.
  • The recommended PCB layout and thermal design for the RTR040N03HZGTL involves using a thermal pad, thermal vias, and a heat sink to dissipate heat efficiently. Consult the ROHM Semiconductor application note for detailed guidelines.
  • When handling the RTR040N03HZGTL, ensure proper safety precautions are taken, such as using protective equipment, following proper soldering and desoldering techniques, and using a suitable test fixture to prevent electrical shock and damage.
  • The RTR040N03HZGTL is an ESD-sensitive device. Handle it with ESD-protective equipment, such as wrist straps, mats, and bags, and follow proper handling and storage procedures to prevent damage.

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RTR040N03HZGTL Overview

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