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RTR040N03TL - ROHM Semiconductor

Description: RTR040N03TL N-Channel MOSFET, 4 A, 30 V, 3-Pin TSMT ROHM

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RTR040N03TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - RTR040N03TL
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3D Models
RTR040N03TL - ROHM Semiconductor  - 3D model - SOT23 (3-Pin) - RTR040N03TL
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RTR040N03TL Details

  • Manufacturer Part Number:

    RTR040N03TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    3

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.066 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RTR040N03TL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RTR040N03TL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines for the device, and consider using thermal management techniques such as heat sinks or thermal interfaces to reduce the junction temperature.
  • The recommended PCB layout and thermal design for the RTR040N03TL involves using a thermal pad on the bottom of the package, and ensuring good thermal conductivity between the device and the PCB. A heat sink or thermal interface material can also be used to improve heat dissipation.
  • To handle the high current handling capability of the RTR040N03TL, ensure that your PCB design can handle the high current, and consider using thick copper traces, multiple vias, and a robust power distribution network.
  • The RTR040N03TL has built-in ESD protection, but it's still essential to follow proper ESD handling and storage procedures to prevent damage to the device. Use ESD-safe materials, and ensure that your manufacturing and assembly processes are ESD-compliant.

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