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RUR040N02TL - ROHM Semiconductor

Description: 1.5V Drive Nch MOSFET: Power MOSFETs are made as low ON-resistance devices by the micro-processing technologies useful for wide range of applications.Broad lineup covering compact types, high-power types and complex types to meet various needs in the market.

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Symbol
RUR040N02TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RUR040N02TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TSMT3
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3D Models
RUR040N02TL - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - TSMT3
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RUR040N02TL Details

  • Manufacturer Part Number:

    RUR040N02TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    21 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    4 A

  • Drain-source On Resistance-Max:

    0.046 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RUR040N02TL Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the RUR040N02TL is -55°C to 150°C.
  • To ensure reliability, it's essential to follow the recommended derating guidelines for the device, and consider using thermal management techniques such as heat sinks or thermal interfaces.
  • The recommended PCB layout and thermal design for the RUR040N02TL involves using a multi-layer PCB with thermal vias, and ensuring good thermal conductivity between the device and the heat sink or thermal interface.
  • When handling the RUR040N02TL, it's essential to follow proper electrostatic discharge (ESD) precautions, use proper soldering techniques, and ensure that the device is properly secured to the PCB to prevent mechanical stress.
  • The RUR040N02TL should be stored in a dry, cool place, away from direct sunlight and moisture. It's also essential to handle the device by the body, rather than the leads, to prevent mechanical stress and damage.

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RUR040N02TL Overview

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