A thermal pad on the bottom of the device should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
Use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the thermal pad and reflow at 220°C to 230°C for 30-60 seconds.
The RXEF135 can withstand voltage transients up to 1.5 times the maximum rated voltage (135V) for a duration of 100ms.
Yes, the RXEF135 is suitable for high-frequency switching applications up to 100 kHz. However, ensure proper thermal management and consider the device's power dissipation limits.
Use a fuse or a current-limiting resistor in series with the RXEF135 to protect against overcurrent conditions. For overvoltage protection, consider using a voltage regulator or a transient voltage suppressor (TVS) diode.
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RXEF135 Overview
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