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RZR025P01TL - ROHM Semiconductor

Description: 1.5V Drive Pch MOSFET: MOSFETs are made as ultra-low ON-resistance by the micro-processing technologies suitable for mobilr equipment for low current consumption. In wide lineup including compact type, high-power type and complex type to meet in the market.

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RZR025P01TL - ROHM Semiconductor - PCB symbol
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PCB Footprints
RZR025P01TL - ROHM Semiconductor PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - TSMT3
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3D Models
RZR025P01TL - ROHM Semiconductor - 3D model - SOT23 (3-Pin) - TSMT3
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RZR025P01TL Details

  • Manufacturer Part Number:

    RZR025P01TL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Package Description:

    TSMT3, 3 PIN

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    2

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    2.5 A

  • Drain-source On Resistance-Max:

    0.061 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e1

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    1 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

RZR025P01TL Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (up to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's junction temperature to prevent overheating.
  • Handle the device by the body, avoiding touching the leads or pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Use anti-static packaging and handling procedures to prevent ESD damage.
  • Choose capacitors with a voltage rating higher than the maximum input voltage. Select capacitors with low ESR and high ripple current ratings to minimize voltage drops and ensure stable operation.
  • Keep the PCB layout compact to minimize noise and EMI. Use a solid ground plane and separate power planes for input and output. Ensure that the input and output capacitors are placed close to the device.

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RZR025P01TL Overview

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