Part Image

S29GL01GT12DHN010 - Infineon

Description: 1 GBIT, 3V, 100NS, 64-BALL FBG

Download S29GL01GT12DHN010 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
S29GL01GT12DHN010 - Infineon PCB footprint - BGA - BGA - LAE064_
click to zoom
3D Models
S29GL01GT12DHN010 - Infineon  - 3D model - BGA - LAE064_
click to zoom

S29GL01GT12DHN010 Details

  • Manufacturer Part Number:

    S29GL01GT12DHN010

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Access Time-Max:

    120 ns

  • JESD-30 Code:

    S-PBGA-B64

  • Length:

    9 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    16

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    64

  • Number of Words:

    67108864 words

  • Number of Words Code:

    64000000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    64MX16

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Parallel/Serial:

    PARALLEL

  • Programming Voltage:

    2.7 V

  • Seated Height-Max:

    1.4 mm

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    9 mm

S29GL01GT12DHN010 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the S29GL01GT12DHN010 is -40°C to +85°C, with a storage temperature range of -65°C to +150°C.
  • The HOLD# signal should be asserted low to pause the current operation and enter a low-power state. De-asserting HOLD# resumes the operation. Note that HOLD# should not be asserted during a write operation, as it may cause data corruption.
  • The WP# signal is used to protect the entire memory array or specific sectors from write operations. When WP# is asserted low, the memory is write-protected. When WP# is de-asserted high, the memory is writable.
  • The optimal clock frequency depends on the specific application and system requirements. The S29GL01GT12DHN010 supports clock frequencies up to 133 MHz. It's recommended to consult the datasheet and application notes for guidance on selecting the optimal clock frequency.
  • The S29GL01GT12DHN010 is a specific part number with a unique combination of features, such as density, package type, and operating voltage. Other similar devices may have different densities, packages, or operating voltages. It's essential to consult the datasheet and compare the features to determine the best device for your application.

Trust Checks

This model has been provided by community users.
Community Provided
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

S29GL01GT12DHN010 Overview

Use the download button to access the S29GL01GT12DHN010 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like S29GL, or try a keyword search, such as Flash Memories

Parts related to S29GL01GT12DHN010

Showing 0 results