S29GL512T10FHI013 - Infineon

S29GL512T10FHI013 Details

• Manufacturer Part Number:

  S29GL512T10FHI013

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Active

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.51

• Factory Lead Time:

  10 Weeks

• Manufacturer:

  Infineon Technologies AG

• YTEOL:

  10

• Access Time-Max:

  100 ns

• Alternate Memory Width:

  8

• Boot Block:

  BOTTOM/TOP

• JESD-30 Code:

  R-PBGA-B64

• JESD-609 Code:

  e1

• Length:

  13 mm

• Memory Density:

  536870912 bit

• Memory IC Type:

  FLASH

• Memory Width:

  16

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  64

• Number of Words:

  33554432 words

• Number of Words Code:

  32000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  32MX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  LBGA

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, LOW PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  260

• Programming Voltage:

  2.7 V

• Seated Height-Max:

  1.4 mm

• Supply Current-Max:

  0.06 mA

• Supply Voltage-Max (Vsup):

  3.6 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Tin/Silver/Copper (Sn/Ag/Cu)

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Type:

  NOR TYPE

• Width:

  11 mm