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S2SC4617G - onsemi

Description: High hFE, 210-460 (typical); Available in 8 mm, 7-inch/3000 Unit Tape and Reel; Low VCE(sat), < 0.5 V; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable; These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant

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PCB Footprints
S2SC4617G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-75 SOT-416 CASE 463-01 ISSUE F
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3D Models
S2SC4617G - onsemi  - 3D model - SOT23 (3-Pin) - SC-75 SOT-416 CASE 463-01 ISSUE F
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S2SC4617G Details

  • Manufacturer Part Number:

    S2SC4617G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-75 (SOT-416) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    463-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • Collector-Emitter Voltage-Max:

    50 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    120

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.125 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    AMPLIFIER

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    180 MHz

S2SC4617G Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the device.
  • Implement a robust thermal management system, ensure proper PCB design, and follow the recommended operating conditions. Also, consider using a thermal interface material (TIM) between the device and heat sink.
  • Choose a heat sink with a high thermal conductivity material (e.g., copper or aluminum), a large surface area, and a low thermal resistance. Ensure the heat sink is compatible with the device's package and thermal interface material.
  • Follow the recommended power-up sequence: VCC, then VDD, and finally VIN. Ensure a soft-start circuit to prevent inrush currents and voltage overshoots.
  • Keep sensitive analog traces away from noisy digital traces, use a solid ground plane, and implement a shielded layout for the device. Ensure a low-impedance path for the device's power and ground connections.

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S2SC4617G Overview

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