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S70FL01GSAGMFI013 - Infineon

Description: FLASH - NOR Memory IC 1Gbit SPI - Quad I/O 133 MHz 16-SOIC

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S70FL01GSAGMFI013 - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - SOIC 16 lead, 300-mil body width
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S70FL01GSAGMFI013 - Infineon  - 3D model - Small Outline Packages - SOIC 16 lead, 300-mil body width
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S70FL01GSAGMFI013 Details

  • Manufacturer Part Number:

    S70FL01GSAGMFI013

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.32.00.51

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    10

  • Clock Frequency-Max (fCLK):

    133 MHz

  • Data Retention Time-Min:

    20

  • Endurance:

    100000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.3 mm

  • Memory Density:

    1073741824 bit

  • Memory IC Type:

    FLASH

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Number of Words:

    134217728 words

  • Number of Words Code:

    128000000

  • Operating Mode:

    SYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128MX8

  • Output Characteristics:

    3-STATE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Parallel/Serial:

    SERIAL

  • Programming Voltage:

    3 V

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.65 mm

  • Serial Bus Type:

    SPI

  • Standby Current-Max:

    0.0002 A

  • Supply Current-Max:

    0.2 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2.7 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Type:

    NOR TYPE

  • Width:

    7.5 mm

  • Write Protection:

    HARDWARE/SOFTWARE

S70FL01GSAGMFI013 Frequently Asked Questions (FAQs)

  • Infineon provides a recommended PCB layout guide in their application note AN215, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and reliability.
  • The S70FL01GSAGMFI013 has a thermal pad that must be connected to a thermal ground plane on the PCB to dissipate heat. A thermal interface material (TIM) can be used to improve heat transfer. Additionally, ensure good airflow and avoid blocking the airflow around the device.
  • The recommended power-up sequence is to apply the core voltage (VCC) first, followed by the input/output voltage (VIO). This ensures that the internal voltage regulators are powered up correctly and prevents damage to the device.
  • A reliable reset circuit can be implemented using a voltage supervisor IC, such as the Infineon XC6210, which monitors the power supply voltage and asserts a reset signal to the S70FL01GSAGMFI013 during power-up or brownout conditions.
  • To ensure EMC compliance, follow the guidelines in the Infineon application note AN215, which includes recommendations for PCB layout, component selection, and shielding to minimize electromagnetic interference (EMI) and ensure reliable operation.

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Part Image S70FL01GSAGMFI013 Spansion

Flash, 128MX8, PDSO16