S71GL032NA0BHW0Z2 - Spansion

S71GL032NA0BHW0Z2 Details

• Manufacturer Part Number:

  S71GL032NA0BHW0Z2

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Transferred

• Part Package Code:

  BGA

• Package Description:

  7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56

• Pin Count:

  56

• ECCN Code:

  EAR99

• HTS Code:

  8542.32.00.71

• Manufacturer:

  Spansion

• Access Time-Max:

  90 ns

• Additional Feature:

  PSRAM IS ORGANIZED AS 1M X 16

• JESD-30 Code:

  R-PBGA-B56

• JESD-609 Code:

  e1

• Length:

  9 mm

• Memory Density:

  33554432 bit

• Memory IC Type:

  MEMORY CIRCUIT

• Memory Width:

  16

• Mixed Memory Type:

  FLASH+SRAM

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  56

• Number of Words:

  2097152 words

• Number of Words Code:

  2000000

• Operating Mode:

  ASYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -25 °C

• Organization:

  2MX16

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TFBGA

• Package Equivalence Code:

  BGA56,8X8,32

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE, FINE PITCH

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.2 mm

• Supply Voltage-Max (Vsup):

  3.1 V

• Supply Voltage-Min (Vsup):

  2.7 V

• Supply Voltage-Nom (Vsup):

  3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  OTHER

• Terminal Finish:

  TIN SILVER COPPER

• Terminal Form:

  BALL

• Terminal Pitch:

  0.8 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  40

• Width:

  7 mm