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SA110DP - Apex Microtechnology

Description: The SA110 is Apex Microtechnology’s first high current, high voltage half H-bridge Integrated Circuit to utilize Silicon Carbide (SiC) MOSFETs with integrated gate drive. SiC MOSFETs provide reduced switching losses, lower conduction losses, and a low dependency of RDS(on) over temperature. The SA110 features integrated gate drive control, a very high 400kHz MAX switching frequency, and 28A of continuous output current in the A grade variant. This hybrid is offered in a 12-pin PSIP package to provide a com

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SA110DP - Apex Microtechnology PCB footprint - Other - Other - SA110DP
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SA110DP - Apex Microtechnology  - 3D model - Other - SA110DP
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SA110DP Details

  • Manufacturer Part Number:

    SA110DP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    USA

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Apex Microtechnology Inc

  • YTEOL:

    7

  • Interface IC Type:

    HALF BRIDGE BASED PERIPHERAL DRIVER

SA110DP Frequently Asked Questions (FAQs)

  • Apex Microtechnology recommends a 4-layer PCB with a solid ground plane and a thermal pad connected to a heat sink or a thermal relief pattern. A minimum of 2 oz copper thickness is recommended for the top and bottom layers. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K is recommended between the device and the heat sink.
  • To ensure reliable operation over the full temperature range, it is essential to follow the recommended operating conditions, including voltage, current, and power dissipation. Additionally, the device should be operated within the specified junction temperature range, and the PCB should be designed to minimize thermal gradients and hotspots.
  • Apex Microtechnology recommends using a 4-wire Kelvin connection for current sensing and a high-impedance voltage probe for voltage measurement. A low-inductance, high-frequency oscilloscope probe is recommended for measuring the device's switching waveforms. Additionally, a thermal imaging camera or a thermocouple can be used to monitor the device's temperature during operation.
  • To prevent EMI and EMC issues, Apex Microtechnology recommends using a shielded enclosure, keeping the PCB layout compact, and using a common-mode choke or ferrite bead on the input and output lines. Additionally, the device should be operated within the specified frequency range, and the PCB should be designed to minimize radiated emissions.
  • Apex Microtechnology provides a reliability report that includes MTBF calculations based on industry-standard models such as MIL-HDBK-217F. The MTBF is typically in the range of 100,000 to 500,000 hours, depending on the operating conditions and environment. However, the actual reliability and MTBF may vary depending on the specific application and usage.

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SA110DP Overview

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