SA58670ABS - NXP

SA58670ABS Details

• Manufacturer Part Number:

  SA58670ABS

• Source Url Status Check Date:

  2013-06-14 00:00:00

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  QFN

• Package Description:

  4 X 4 MM, 0.85 MM HEIGHT, PLASTIC, MO-220, SOT917-1, HVQFN-20

• Pin Count:

  20

• ECCN Code:

  EAR99

• HTS Code:

  8542.33.00.01

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Bandwidth-Nom:

  20 kHz

• Consumer IC Type:

  CLASS D AUDIO AMPLIFIER

• Gain:

  24 dB

• JESD-30 Code:

  S-PQCC-N20

• JESD-609 Code:

  e4

• Length:

  4 mm

• Moisture Sensitivity Level:

  1

• Number of Channels:

  2

• Number of Functions:

  1

• Number of Terminals:

  20

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Output Power-Nom:

  2.1 W

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  HVQCCN

• Package Equivalence Code:

  LCC20,.16SQ,20

• Package Shape:

  SQUARE

• Package Style:

  CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

• Peak Reflow Temperature (Cel):

  260

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1 mm

• Supply Current-Max:

  9 mA

• Supply Voltage-Max (Vsup):

  5.5 V

• Supply Voltage-Min (Vsup):

  2.5 V

• Surface Mount:

  YES

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  Nickel/Palladium/Gold (Ni/Pd/Au)

• Terminal Form:

  NO LEAD

• Terminal Pitch:

  0.5 mm

• Terminal Position:

  QUAD

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  4 mm