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SA58672UK,027 - NXP

Description: NXP SA58672UK Audio Amplifier, Class-D Mono -69dB,WLCSP9

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PCB Footprints
SA58672UK,027 - NXP PCB footprint - BGA - BGA - WLCSP9_1
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SA58672UK,027 - NXP  - 3D model - BGA - WLCSP9_1
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SA58672UK,027 Details

  • Manufacturer Part Number:

    SA58672UK,027

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    CSP

  • Package Description:

    1.66 X 1.71 MM, 0.60 MM HEIGHT, WLCSP-9

  • Pin Count:

    9

  • Manufacturer Package Code:

    OL-SA58672UK

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Bandwidth-Nom:

    20 kHz

  • Consumer IC Type:

    CLASS D AUDIO AMPLIFIER

  • JESD-30 Code:

    R-PBGA-B9

  • Length:

    1.71 mm

  • Number of Channels:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    9

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Power-Nom:

    3 W

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    VFBGA

  • Package Equivalence Code:

    BGA9,3X3,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY, VERY THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    0.64 mm

  • Supply Current-Max:

    4.2 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    1.66 mm

SA58672UK,027 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the RF traces short and away from digital signals. Use a 50-ohm microstrip line for the RF output.
  • Use a heat sink or thermal pad to dissipate heat. Ensure good airflow around the device. Follow the recommended operating conditions and derating guidelines in the datasheet.
  • The device can handle up to 10 dBm of input power. Exceeding this may cause damage or affect performance. Use an attenuator or limiter if necessary.
  • Use the recommended biasing and matching networks. Optimize the input and output impedance matching for the specific frequency band of operation.
  • The typical current consumption is around 40-50 mA, depending on the operating conditions and frequency band. Refer to the datasheet for detailed current consumption characteristics.

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SA58672UK,027 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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