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SBC847CDXV6T1G - onsemi

Description: These are Pb-Free Devices; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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SBC847CDXV6T1G - onsemi PCB footprint - SO Transistor Flat Lead - SO Transistor Flat Lead - SOT-563 6 LEAD CASE 463A-01 ISSUE O
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SBC847CDXV6T1G - onsemi  - 3D model - SO Transistor Flat Lead - SOT-563 6 LEAD CASE 463A-01 ISSUE O
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SBC847CDXV6T1G Details

  • Manufacturer Part Number:

    SBC847CDXV6T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-563, 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    463A-01

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.1 A

  • DC Current Gain-Min (hFE):

    420

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.5 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transition Frequency-Nom (fT):

    100 MHz

SBC847CDXV6T1G Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the SBC847CDXV6T1G is -40°C to 125°C.
  • To ensure reliable operation in high-temperature environments, it is recommended to follow proper thermal design and management practices, such as providing adequate heat sinking and airflow, and ensuring that the device is operated within its specified temperature range.
  • Exceeding the maximum junction temperature (Tj) of the SBC847CDXV6T1G can lead to reduced device reliability, increased thermal resistance, and potentially even device failure. It is essential to ensure that the device is operated within its specified temperature range to prevent overheating.
  • To handle ESD protection for the SBC847CDXV6T1G, it is recommended to follow proper ESD handling and storage procedures, such as using ESD-safe materials, grounding oneself before handling the device, and storing the device in ESD-protective packaging.
  • For optimal performance and reliability, it is recommended to follow proper PCB layout and design considerations, such as minimizing trace lengths, using wide traces for power and ground, and ensuring adequate decoupling and bypassing.

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