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SBCX19LT1G - onsemi

Description: Pb-Free Packages are Available; S Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
SBCX19LT1G - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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3D Models
SBCX19LT1G - onsemi  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236) CASE 318-08
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SBCX19LT1G Details

  • Manufacturer Part Number:

    SBCX19LT1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT-23 (TO-236) 3 LEAD

  • Pin Count:

    3

  • Manufacturer Package Code:

    318

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    7

  • Collector Current-Max (IC):

    0.5 A

  • Collector-Emitter Voltage-Max:

    45 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    40

  • JEDEC-95 Code:

    TO-236

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.3 W

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

SBCX19LT1G Frequently Asked Questions (FAQs)

  • A good PCB layout should ensure minimal thermal resistance, use thermal vias, and keep the component away from heat sources. A heat sink or thermal pad can be used to improve heat dissipation. Consult onsemi's application notes and thermal management guidelines for more information.
  • Follow onsemi's recommended operating conditions, use a heat sink or thermal pad, and ensure good airflow. Consider using a thermistor or temperature sensor to monitor the device temperature and implement thermal protection if necessary.
  • The SBCX19LT1G has built-in ESD protection, but handling precautions are still necessary. Use an ESD wrist strap, mat, or workstation, and follow proper handling and storage procedures to prevent damage.
  • Yes, the SBCX19LT1G is suitable for high-reliability and automotive applications. However, ensure that you follow onsemi's guidelines for qualification, testing, and validation, and comply with relevant industry standards such as AEC-Q101.
  • Consult onsemi's troubleshooting guides and application notes, and perform basic checks such as verifying the power supply, signal integrity, and PCB layout. Use oscilloscopes or logic analyzers to debug the issue, and consider contacting onsemi's technical support for further assistance.

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SBCX19LT1G Overview

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