SC16IS850LIPW,112 - NXP

SC16IS850LIPW,112 Details

• Manufacturer Part Number:

  SC16IS850LIPW,112

• Source Url Status Check Date:

  2013-06-14 00:00:00

• Brand Name:

  NXP Semiconductor

• Rohs Code:

  Yes

• Part Life Cycle Code:

  Obsolete

• Part Package Code:

  TSSOP2

• Package Description:

  4.40 MM, LEAD FREE, PLASTIC, MO-153, SOT355-1, TSSOP-24

• Pin Count:

  24

• Manufacturer Package Code:

  SOT355-1

• HTS Code:

  8542.31.00.30

• Manufacturer:

  NXP Semiconductors

• YTEOL:

  0

• Address Bus Width:

  2

• Boundary Scan:

  NO

• Clock Frequency-Max:

  80 MHz

• Communication Protocol:

  ASYNC, BIT; I2C

• Data Encoding/Decoding Method:

  NRZB

• Data Transfer Rate-Max:

  0.625 MBps

• External Data Bus Width:

  8

• JESD-30 Code:

  R-PDSO-G24

• Length:

  7.8 mm

• Low Power Mode:

  YES

• Number of Serial I/Os:

  1

• Number of Terminals:

  24

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TSSOP

• Package Equivalence Code:

  TSSOP24,.25

• Package Shape:

  RECTANGULAR

• Package Style:

  SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.1 mm

• Supply Voltage-Max:

  1.95 V

• Supply Voltage-Min:

  1.65 V

• Supply Voltage-Nom:

  1.8 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Form:

  GULL WING

• Terminal Pitch:

  0.65 mm

• Terminal Position:

  DUAL

• Width:

  4.4 mm

• uPs/uCs/Peripheral ICs Type:

  SERIAL IO/COMMUNICATION CONTROLLER, I2C BUS