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SCAN92LV090VEH/NOPB - Texas Instruments

Description: LVDS Interface IC 9-channel bus LVDS transceiver with boundary SCAN 64-LQFP -40 to 85

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SCAN92LV090VEH/NOPB - Texas Instruments PCB footprint - Quad Flat Packages - Quad Flat Packages - LQFP - 1.6 mm max heigh
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SCAN92LV090VEH/NOPB - Texas Instruments  - 3D model - Quad Flat Packages - LQFP - 1.6 mm max heigh
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SCAN92LV090VEH/NOPB Details

  • Manufacturer Part Number:

    SCAN92LV090VEH/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFP

  • Pin Count:

    64

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Differential Output:

    YES

  • Driver Number of Bits:

    9

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    IEEE 1149.1

  • JESD-30 Code:

    S-PQFP-G64

  • JESD-609 Code:

    e3

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    9

  • Number of Terminals:

    64

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.24 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.002 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP64,.47SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Receive Delay-Max:

    3.9 ns

  • Receiver Number of Bits:

    9

  • Seated Height-Max:

    1.6 mm

  • Supply Current-Max:

    210 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    3.6 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2.6 ns

  • Width:

    10 mm

SCAN92LV090VEH/NOPB Frequently Asked Questions (FAQs)

  • Texas Instruments provides a recommended PCB layout in the datasheet, but it's essential to follow good PCB design practices, such as using a solid ground plane, minimizing signal trace lengths, and avoiding vias under the device. Additionally, ensure that the PCB material has a low dielectric constant to minimize signal reflections.
  • The SCAN92LV090VEH/NOPB has a thermal pad on the bottom, which should be connected to a solid ground plane or a thermal relief pattern on the PCB. Ensure good airflow around the device, and consider using a heat sink or thermal interface material if the device will be operating in high-temperature environments.
  • The maximum clock frequency for the SCAN92LV090VEH/NOPB is 100 MHz, but it's essential to consider the system's signal integrity, PCB layout, and device loading when operating at high frequencies. Ensure that the clock signal is clean and has a low jitter to prevent data corruption.
  • To ensure data integrity, use a robust clocking scheme, implement data buffering, and consider using error detection and correction mechanisms such as CRC or ECC. Additionally, ensure that the device is properly powered, and the power supply is clean and stable.
  • The SCAN92LV090VEH/NOPB requires a specific power sequencing to prevent damage or malfunction. Ensure that the VCC supply is powered up before the VREF supply, and that the VCC supply is stable before applying clock signals or input data.

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SCAN92LV090VEH/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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