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SCC2691AC1D24 - NXP

Description: Universal asynchronous receiver/transmitter (UART) Voltage - Supply 5V Voltage –0.5 to + 7.0

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SCC2691AC1D24 - NXP PCB footprint - Small Outline Packages - Small Outline Packages - SOT137-1
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SCC2691AC1D24 - NXP  - 3D model - Small Outline Packages - SOT137-1
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SCC2691AC1D24 Details

  • Manufacturer Part Number:

    SCC2691AC1D24

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    7.50 MM, PLASTIC, MS-013, SOT-137-1, SOL-24

  • Pin Count:

    24

  • HTS Code:

    8542.31.00.30

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    3

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    4 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.0046875 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDSO-G24

  • Length:

    15.4 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    1

  • Number of Serial I/Os:

    1

  • Number of Terminals:

    24

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP24,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • RAM (words):

    0

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    2 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCC2691AC1D24 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern under the package.
  • Implement a thermal management strategy, such as heat sinks, thermal interfaces, or fans. Ensure proper airflow and avoid thermal hotspots.
  • Use 100 nF to 1 μF decoupling capacitors, placed as close as possible to the device's power pins. Follow the datasheet's recommended layout and placement guidelines.
  • Implement ESD protection devices, such as TVS diodes or ESD arrays, on the input lines. Ensure proper PCB layout and routing to minimize ESD susceptibility.
  • Set the internal voltage regulator to 1.2 V or 1.8 V, depending on the application's requirements. Ensure proper bypassing and decoupling to minimize noise and ripple.

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SCC2691AC1D24 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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Part Image 935002730518 NXP Semiconductors

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Part Image SCC2691AC1D24/N,51 NXP Semiconductors

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For a full list of alternate parts for SCC2691AC1D24, check out Findchips.com