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SCC2692AC1A44 - NXP

Description: UART IC 2, DUART Channel 44-PLCC

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SCC2692AC1A44 - NXP PCB footprint - Plastic Leaded Chip Carrier - Plastic Leaded Chip Carrier - SOT187-2
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3D Models
SCC2692AC1A44 - NXP  - 3D model - Plastic Leaded Chip Carrier - SOT187-2
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SCC2692AC1A44 Details

  • Manufacturer Part Number:

    SCC2692AC1A44

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    LCC

  • Package Description:

    PLASTIC, LCC-44

  • Pin Count:

    44

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    3.6864 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    S-PQCC-J44

  • JESD-609 Code:

    e3

  • Length:

    16.5862 mm

  • Low Power Mode:

    YES

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    15

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QCCJ

  • Package Equivalence Code:

    LDCC44,.7SQ

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    245

  • Qualification Status:

    Not Qualified

  • RAM (words):

    0

  • Seated Height-Max:

    4.57 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    J BEND

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    16.5862 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCC2692AC1A44 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including heat sinks, thermal interfaces, and airflow. Ensure the device is operated within the specified temperature range and follow the recommended derating guidelines.
  • The critical timing parameters include the clock frequency, setup and hold times, and propagation delay. Refer to the datasheet for specific values and ensure your design meets these requirements.
  • Implement ESD protection devices, such as TVS diodes or ESD arrays, on the I/O lines. Ensure the protection devices are rated for the maximum voltage and current of the application.
  • Follow the recommended power sequencing and voltage ramp-up times specified in the datasheet. Typically, a slow voltage ramp-up (e.g., 1-2 ms) and a power-on reset (POR) circuit are recommended.

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SCC2692AC1A44 Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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