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SCC2692AC1N28,129 - NXP

Description: 28DIP

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SCC2692AC1N28,129 - NXP - PCB symbol
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PCB Footprints
SCC2692AC1N28,129 - NXP PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - SOT117-1
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3D Models
SCC2692AC1N28,129 - NXP - 3D model - Dual-In-Line Packages - SOT117-1
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SCC2692AC1N28,129 Details

  • Manufacturer Part Number:

    SCC2692AC1N28,129

  • Brand Name:

    NXP Semiconductor

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    DIP

  • Package Description:

    0.600 INCH, PLASTIC, DIP-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    SOT117-1

  • HTS Code:

    8542.31.00.01

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    0

  • Address Bus Width:

    4

  • Boundary Scan:

    NO

  • Clock Frequency-Max:

    3.6864 MHz

  • Communication Protocol:

    ASYNC, BIT

  • Data Encoding/Decoding Method:

    NRZ

  • Data Transfer Rate-Max:

    0.125 MBps

  • External Data Bus Width:

    8

  • JESD-30 Code:

    R-PDIP-T28

  • JESD-609 Code:

    e3

  • Length:

    35.5 mm

  • Low Power Mode:

    YES

  • Number of Serial I/Os:

    2

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    NO

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    15.24 mm

  • uPs/uCs/Peripheral ICs Type:

    SERIAL IO/COMMUNICATION CONTROLLER, SERIAL

SCC2692AC1N28,129 Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout in the application note AN11529, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize electromagnetic interference (EMI).
  • NXP provides a component selection guide in the application note AN11529, which includes recommendations for external components such as resistors, capacitors, and inductors. Additionally, the NXP website offers a component selector tool to help engineers choose the correct components for their specific design.
  • The SCC2692AC1N28,129 has a thermal pad on the bottom of the package, which requires a thermal connection to a heat sink or a thermal pad on the PCB. NXP recommends using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/mK to ensure effective heat dissipation. A thermal management strategy should be implemented to keep the junction temperature below 125°C.
  • NXP provides a troubleshooting guide in the application note AN11529, which includes common issues and their solutions, such as debugging techniques, error detection, and fault diagnosis. Additionally, NXP offers a support forum and technical support team to help engineers troubleshoot issues with their design.
  • The SCC2692AC1N28,129 is manufactured according to NXP's quality and reliability standards, which include compliance with industry standards such as AEC-Q100 and ISO/TS 16949. NXP also provides a reliability report and a quality manual that outlines the testing and inspection procedures used to ensure the device meets the required standards.

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SCC2692AC1N28,129 Overview

Use the download button to access the SCC2692AC1N28,129 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SCC26, or try a keyword search, such as Serial IO/Communication Controllers

About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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