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- Part Number SE2565T-R
- Manufacturer Skyworks
- Pin Count 17
- Part Category Integrated Circuit
- Package Category Quad Flat No-Lead
- Footprint Name Quad Flat No-Lead - EEE-FK1E100R
- Released Date Apr 28, 2019
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SE2565T-R Details
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Manufacturer Part Number:
SE2565T-R
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Part Package Code:
QFN
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Package Description:
3 X 3 MM, 0.60 MM HEIGHT, ROHS COMPLIANT, QFN-16
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Pin Count:
16
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HTS Code:
8542.39.00.01
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Manufacturer:
Skyworks Solutions Inc
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JESD-30 Code:
S-XQCC-N16
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Length:
3 mm
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Moisture Sensitivity Level:
3
SE2565T-R Frequently Asked Questions (FAQs)
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The recommended PCB layout involves using a 4-layer board with a solid ground plane, and placing the device near the edge of the board to minimize thermal resistance. Thermal management involves using a heat sink or thermal pad to dissipate heat, and ensuring good airflow around the device.
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Optimizing the input and output matching networks involves using a combination of simulation tools and empirical methods to achieve the best possible impedance match. This may involve using a Smith chart to visualize the impedance, and adjusting the component values to achieve a good match.
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Critical parameters to monitor during reliability testing include junction temperature, power output, and DC bias. Acceptable limits vary depending on the specific application, but typical limits include a junction temperature of 150°C, power output of 2W, and DC bias of 5V.
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Ensuring EMC and reducing EMI involves using a combination of shielding, filtering, and layout techniques. This includes using a metal enclosure, adding EMI filters to the input and output, and minimizing loop areas and trace lengths in the PCB layout.
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Recommended soldering and assembly techniques include using a reflow soldering process with a peak temperature of 260°C, and ensuring that the device is handled and stored in a static-protected environment to prevent ESD damage.
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SE2565T-R Overview
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