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SGM41524YTDC8G/TR - SGMICRO

Description: Constant Current, Constant Voltage (CCCV) Charging with Floating Time-Out Timer●Constant Current Pre-charge ●Maximum 2.3A Charging for 4.2V to 4.5V Battery●1.34MHz Switching Frequency●Programmable Charge Voltage and Current●4.15V Input Voltage Regulation●Output Voltage Fold-Back Charge Retaining●Thermal Regulation OptionsSGM41524: +115°CSGM41524C: +55°C●Typical Peak Efficiency of 92% at 1.5A, VIN = 5V●-40°Cto +85°COperating Temperature Range

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PCB Footprints
SGM41524YTDC8G/TR - SGMICRO PCB footprint - Small Outline No-lead - Small Outline No-lead - TDFN-2×3-8BL.
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3D Models
SGM41524YTDC8G/TR - SGMICRO  - 3D model - Small Outline No-lead - TDFN-2×3-8BL.
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SGM41524YTDC8G/TR Details

  • Manufacturer Part Number:

    SGM41524YTDC8G/TR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    TDFN-8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    SG Micro Corp

  • YTEOL:

    7

  • Adjustable Threshold:

    YES

  • Analog IC - Other Type:

    LINEAR BATTERY CHARGER

  • JESD-30 Code:

    R-XDSO-N8

  • Length:

    3 mm

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC8,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Packing Method:

    TR, 7 INCH

  • Seated Height-Max:

    0.8 mm

  • Supply Current-Max (Isup):

    0.021 mA

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    3.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Threshold Voltage-Nom:

    5.67

  • Width:

    2 mm

SGM41524YTDC8G/TR Frequently Asked Questions (FAQs)

  • SG Micro Corp recommends following a 4-layer PCB stackup with a dedicated power plane and a thermal pad connected to a heat sink or a thermal via array to ensure efficient heat dissipation. A minimum of 2oz copper thickness is recommended for the power plane.
  • The SGM41524YTDC8G/TR requires a power-on reset (POR) circuit to ensure proper startup. A 10uF capacitor on the VCC pin and a 1kΩ resistor on the EN pin are recommended. Additionally, the device should be configured through the I2C interface during startup, following the recommended sequence outlined in the datasheet.
  • The SGM41524YTDC8G/TR is rated for operation up to 125°C. However, the device's performance and reliability may degrade above 100°C. It is essential to ensure proper thermal management, reduce power consumption, and consider derating the device's specifications according to the datasheet's thermal derating curve.
  • SG Micro Corp recommends using a logic analyzer or an oscilloscope to monitor the I2C bus and verify the communication protocol. Additionally, checking the device's status registers and error flags can help identify the root cause of the issue. Consult the datasheet's troubleshooting section and contact SG Micro Corp's technical support for further assistance.
  • The SGM41524YTDC8G/TR has built-in ESD protection, but it is still essential to follow proper handling and storage procedures to prevent damage. Handle the device by the body or use an ESD wrist strap, and store it in an anti-static bag or container. Avoid touching the device's pins or exposing it to electrostatic charges.

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SGM41524YTDC8G/TR Overview

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