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SHN1B01FDW1T1G - onsemi

Description: High Voltage and High Current: VCEO = 50 V, IC = 200 mA; High hFE: hFE = 200-400; Moisture Sensitivity Level: 1; ESD Rating - Human Body Model: 3A - Machine Model: C; Pb-Free Package is Available; S and NSV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC-Q101 Qualified and PPAP Capable

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PCB Footprints
SHN1B01FDW1T1G - onsemi PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-74 CASE 318F-05
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3D Models
SHN1B01FDW1T1G - onsemi  - 3D model - SOT23 (6-Pin) - SC-74 CASE 318F-05
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SHN1B01FDW1T1G Details

  • Manufacturer Part Number:

    SHN1B01FDW1T1G

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SC-74 (SC-59ML) 6 LEAD

  • Pin Count:

    6

  • Manufacturer Package Code:

    318F-05

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    6

  • Collector Current-Max (IC):

    0.2 A

  • DC Current Gain-Min (hFE):

    200

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    150 °C

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN AND PNP

  • Power Dissipation-Max (Abs):

    0.38 W

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Time@Peak Reflow Temperature-Max (s):

    30

SHN1B01FDW1T1G Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a solid copper plane on the top and bottom layers, with multiple vias connecting them to dissipate heat effectively. Additionally, keeping the component away from other heat sources and using thermal vias under the device can help.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating conditions, provide adequate heat sinking, and consider derating the device's power handling capabilities. Additionally, using a thermal interface material (TIM) between the device and heat sink can improve heat transfer.
  • The SHN1B01FDW1T1G has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures during assembly and testing. This includes using an ESD wrist strap, mat, or workstation, and ensuring that the device is not exposed to static electricity during handling.
  • Yes, the SHN1B01FDW1T1G is suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions, and ensure that the device is properly qualified and validated for the specific application. Additionally, onsemi provides automotive-qualified versions of this device, which should be used in automotive applications.
  • The recommended soldering conditions for the SHN1B01FDW1T1G are a peak temperature of 260°C, with a soldering time of 10-30 seconds. It's essential to follow the recommended soldering profile to prevent damage to the device.

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SHN1B01FDW1T1G Overview

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