SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR
DS Breakdown Voltage-Min:
20 V
Drain Current-Max (ID):
0.485 A
Drain-source On Resistance-Max:
0.7 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
R-PDSO-F6
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
6
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
0.25 W
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
MATTE TIN
Terminal Form:
FLAT
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
SI1024X-T1-GE3 Frequently Asked Questions (FAQs)
The recommended PCB footprint for the SI1024X-T1-GE3 is a rectangular pad with a size of 1.3 mm x 0.8 mm, with a 0.5 mm radius corner. The pad should be centered on the component and have a solder mask defined (SMD) pad shape.
The SI1024X-T1-GE3 has a thermal resistance of 12.5°C/W. To manage thermal performance, ensure good airflow around the component, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and consider using a heat sink or thermal pad.
The SI1024X-T1-GE3 has an operating temperature range of -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
The SI1024X-T1-GE3 is a commercial-grade component and may not meet the stringent requirements of high-reliability or aerospace applications. For such applications, consider using a component with a higher qualification level, such as a MIL-PRF-19500 or ESCC-qualified device.
To ensure proper soldering, use a soldering iron with a temperature of 260°C to 280°C, and apply a solder paste with a melting point of 217°C to 221°C. The component should be placed on the PCB with a soldering time of 2-3 seconds per pin.
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SI1024X-T1-GE3 Overview
Use the download button to access the SI1024X-T1-GE3 schematic symbol and PCB footprint.
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