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SI1026X-T1-GE3 - Vishay

Description: Vishay SI1026X-T1-GE3 Dual N-channel MOSFET, 300 mA, 60 V, 6-Pin SOT-523

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SI1026X-T1-GE3 - Vishay PCB footprint - Other - Other - SI1026X-T1-GE3-1
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SI1026X-T1-GE3 - Vishay  - 3D model - Other - SI1026X-T1-GE3-1
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SI1026X-T1-GE3 Details

  • Manufacturer Part Number:

    SI1026X-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, MINIATURE, SC-89, 6 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    LOW THRESHOLD

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    0.305 A

  • Drain-source On Resistance-Max:

    1.4 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-F6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.28 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    FLAT

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI1026X-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI1026X-T1-GE3 is a standard SOT23-6 package with a 1.3mm x 1.3mm body size and a 0.5mm pitch. The datasheet provides a recommended land pattern and soldering guidelines.
  • To ensure reliability in high-temperature applications, follow the recommended operating conditions and derating guidelines in the datasheet. Additionally, consider using a thermal pad or heat sink to dissipate heat, and ensure good airflow around the device.
  • The maximum allowed voltage on the enable pin (EN) of the SI1026X-T1-GE3 is the same as the maximum supply voltage (VIN), which is 6.5V. Exceeding this voltage may damage the device.
  • Yes, the SI1026X-T1-GE3 is suitable for switching regulator applications due to its high-frequency capability and low RDS(on). However, ensure that the device is properly bypassed and decoupled to minimize noise and voltage spikes.
  • To calculate the power dissipation of the SI1026X-T1-GE3, use the equation: Pd = (VIN x IIN) + (VDS x IDS). Where VIN is the input voltage, IIN is the input current, VDS is the drain-source voltage, and IDS is the drain-source current. Refer to the datasheet for thermal resistance and junction-to-ambient thermal resistance values.

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