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Si1308EDL-T1-GE3 - Vishay

Description: MOSFET N-Ch 30V 1.5A TrenchFET SC70 Vishay Si1308EDL-T1-GE3 N-channel MOSFET Transistor, 1.5 A, 30 V, 3-Pin SC-70

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Symbol
Si1308EDL-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
Si1308EDL-T1-GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SC-70_3LEADS
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3D Models
Si1308EDL-T1-GE3 - Vishay - 3D model - SOT23 (3-Pin) - SC-70_3LEADS
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Si1308EDL-T1-GE3 Details

  • Manufacturer Part Number:

    SI1308EDL-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-323, SC-70, 3 PIN

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.132 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    11 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.5 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

Si1308EDL-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI1308EDL-T1-GE3 is a standard SOT23-6 package with a 1.6mm x 1.6mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
  • To ensure proper biasing, connect the input pin (VIN) to a stable voltage source between 2.5V to 5.5V, and the enable pin (EN) to a logic-level signal (0V or VIN). The output pin (VOUT) should be decoupled with a 1uF ceramic capacitor to ensure stability.
  • The SI1308EDL-T1-GE3 is rated for operation in an ambient temperature range of -40°C to +125°C. However, the device's performance and reliability may degrade at extreme temperatures.
  • Yes, the SI1308EDL-T1-GE3 is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, it's essential to follow the recommended operating conditions and design guidelines to ensure the device meets the specific application requirements.
  • To prevent ESD damage, handle the SI1308EDL-T1-GE3 with an anti-static wrist strap or mat, and ensure the PCB is properly grounded. Avoid touching the device's pins or handling the device in environments with high electrostatic potential.

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Si1308EDL-T1-GE3 Overview

Use the download button to access the Si1308EDL-T1-GE3 schematic symbol, PCB footprint, and 3D model.
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