SI1317DL-T1-GE3 footprint, schematic symbol and 3D model by Vishay

Symbol

click to zoom

PCB Footprints

click to zoom

3D Models

click to zoom

Datasheet Download Datasheet
Stock & Prices Price & Stock for SI1317DL-T1-GE3
Part Number SI1317DL-T1-GE3
Manufacturer Vishay
Pin Count 3
Part Category MOSFET (P-Channel)
Package Category SOT23 (3-Pin)
Footprint Name SOT23 (3-Pin) - SC-70: 3-LEQADS
Released Date Jan 12, 2017
Last Modified Date Sep 8, 2023 6:25 AM UTC
Pinout / Pin List Click Here (Member Only)

SI1317DL-T1-GE3 Details

Manufacturer Part Number:
SI1317DL-T1-GE3
Rohs Code:
Yes
Part Life Cycle Code:
Active
Package Description:
SC-70, SOT-323, 3 PIN
Country Of Origin:
Mainland China
ECCN Code:
EAR99
Factory Lead Time:
19 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
7
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
20 V
Drain Current-Max (ID):
1.4 A
Drain-source On Resistance-Max:
0.15 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
Feedback Cap-Max (Crss):
44 pF
JESD-30 Code:
R-PDSO-G3
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
3
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Operating Temperature-Min:
-50 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
P-CHANNEL
Power Dissipation-Max (Abs):
0.5 W
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON

SI1317DL-T1-GE3 Frequently Asked Questions (FAQs)

The recommended PCB footprint for the SI1317DL-T1-GE3 is a standard SOT23-6 package with a 1.8mm x 1.35mm body size. A minimum pad size of 0.8mm x 0.8mm is recommended for reliable soldering.
To ensure proper biasing, connect the VIN pin to a stable voltage source between 2.5V and 5.5V, and the EN pin to a logic-level signal (e.g., 0V or VIN) to enable or disable the device. Additionally, decouple the VIN pin with a 1uF ceramic capacitor to minimize noise and ensure stable operation.
The maximum allowable power dissipation for the SI1317DL-T1-GE3 is 1.4W at an ambient temperature of 25°C. However, this value can be derated based on the operating temperature and PCB design. Consult the datasheet for thermal resistance and power dissipation calculations.
The SI1317DL-T1-GE3 is rated for operation up to 125°C. However, the device's performance and reliability may degrade at elevated temperatures. Consult the datasheet for temperature-related specifications and derating factors.
To protect the SI1317DL-T1-GE3 from ESD and overvoltage, use a TVS diode or a transient voltage suppressor on the input pins. Additionally, consider adding a series resistor and a capacitor to the input pins to filter out noise and transients.

Trust Checks

System Verified

SI1317DL-T1-GE3 Overview

Use the download button to access the SI1317DL-T1-GE3 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like SI131, or try a keyword search, such as Small Signal Field-Effect Transistors

Parts related to SI1317DL-T1-GE3

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →

SI1317DL-T1-GE3 - Vishay

SI1317DL-T1-GE3 Details

SI1317DL-T1-GE3 Frequently Asked Questions (FAQs)

Trust Checks

SI1317DL-T1-GE3 Overview

Parts related to SI1317DL-T1-GE3