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SI1553DL-T1-E3 - Vishay

Description: MOSFET N/P-CH 20V SC70-6

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PCB Footprints
SI1553DL-T1-E3 - Vishay PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-70 6 LEADS
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3D Models
SI1553DL-T1-E3 - Vishay  - 3D model - SOT23 (6-Pin) - SC-70 6 LEADS
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SI1553DL-T1-E3 Details

  • Manufacturer Part Number:

    SI1553DL-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    ROHS COMPLIANT, SC-70, 6 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.66 A

  • Drain-source On Resistance-Max:

    0.385 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.3 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Element Material:

    SILICON

SI1553DL-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SI1553DL-T1-E3 is a 0603 package with a land pattern of 0.063 inches (1.6 mm) in length and 0.031 inches (0.8 mm) in width. It's essential to follow the recommended footprint to ensure proper soldering and thermal performance.
  • To handle thermal considerations, ensure a good thermal connection between the device and the PCB. Use a thermal pad or a copper pour on the PCB to dissipate heat. Keep the device away from heat sources and ensure good airflow around the component. The maximum operating junction temperature is 150°C.
  • The recommended soldering profile for SI1553DL-T1-E3 is a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation. Avoid using wave soldering or hand soldering as it may damage the device.
  • Yes, SI1553DL-T1-E3 is compatible with lead-free soldering. The device is RoHS compliant and can be soldered using lead-free solder alloys such as SAC305 or Sn96.5Ag3Cu0.5.
  • The moisture sensitivity level (MSL) of SI1553DL-T1-E3 is MSL 1, which means it can withstand a maximum of 30 days in a humidity-controlled environment before soldering. It's essential to follow proper storage and handling procedures to prevent moisture absorption.

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SI1553DL-T1-E3 Overview

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