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SI1912EDH-T1-E3 - Vishay

Description: SI1912EDH-T1-E3, Dual N-channel MOSFET Transistor 1.13 A 20 V, 6-Pin SOT-363

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Symbol
SI1912EDH-T1-E3 - Vishay - PCB symbol
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PCB Footprints
SI1912EDH-T1-E3 - Vishay PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SC-70 6 LEADS
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3D Models
SI1912EDH-T1-E3 - Vishay - 3D model - SOT23 (6-Pin) - SC-70 6 LEADS
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SI1912EDH-T1-E3 Details

  • Manufacturer Part Number:

    SI1912EDH-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SC-70, 6 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Additional Feature:

    ESD PROTECTION

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    1.13 A

  • Drain-source On Resistance-Max:

    0.28 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.74 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI1912EDH-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SI1912EDH-T1-E3 can be found in the Vishay Intertechnologies' application note 'Land Pattern Recommendations for QFN Packages' (document number 28353).
  • The thermal pad should be connected to a solid copper plane on the PCB to ensure good thermal dissipation. A thermal relief pattern can be used to connect the thermal pad to the copper plane. Additionally, a non-conductive epoxy or thermal interface material can be used to fill the gap between the thermal pad and the PCB.
  • The maximum operating temperature range for the SI1912EDH-T1-E3 is -55°C to 150°C. However, the device's performance and reliability may degrade if operated at the extreme ends of this range for extended periods.
  • Yes, the SI1912EDH-T1-E3 is qualified for automotive and high-reliability applications. It meets the requirements of AEC-Q101 and is PPAP capable. However, it's essential to consult with Vishay Intertechnologies' sales team or a qualified distributor to ensure the device meets the specific requirements of your application.
  • To ensure proper soldering, follow the recommended soldering profile and temperature guidelines provided in the Vishay Intertechnologies' application note 'Soldering Profile for QFN Packages' (document number 28354). Additionally, use a solder with a melting point below 260°C to prevent damage to the device.

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SI1912EDH-T1-E3 Overview

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